| 摘要 |
<p>A connecting device provided with contact terminals (42) which are brought into contact with an object to be inspected. The contact area is small and accordingly the contact point density is high. Projections for forming the terminals (42) are formed by anisotropically etching a silicon wafer (28) using a silicon dioxide film as a mask, and cantilevers having the projections of U-shape cross section are formed by anisotropically etching the silicon dioxide film around the projections. The terminals (42) and lead-out wiring (40) are formed using a conductive coating film. The wafer (28) and a wiring board (70) are united in one body with a buffer layer (46) in between. Thereafter, the lead-out wiring (72) is connected to electrodes (73) on the board (70).</p> |
