Solid phase conformal coating suitable for use with electronic devices

摘要

An electronic device (100) comprises a circuit carrying substrate (300) having an electronic circuit pattern (301) formed thereon, at least one component (302) having leads (304) for electrically coupling the at least one component (302) to the electronic circuit pattern (301) formed on the circuit carrying substrate (300), and a thermoplastic coating (200, 200') for covering the leads (304) of the at least one component (302) to insulate the leads (304) thereof.