发明名称 MULTILAYERED PRINTED WIRING BOARD
摘要 PURPOSE:To save lots of inspection man-hours by a method wherein resin smear generated on a multilayered printed wiring board and its size are easily detected through a non-destructive method. CONSTITUTION:A resin smear inspection through-hole 4 is provided to a multilayered printed wiring board, inner patterns 6 are provided in a radial manner around the through-hole 4 centering on it, and through-holes 2a to 2h used for making contact with outer layers are provided to the terminal ends of the inner patterns 6. By this constitution, the conduction of each of the through-holes 2a to 2h is checked on the basis of the inspection through-hole 4, whereby resin smear generated on a multilayered printed wiring board and its size are easily detected through a non-destructive method.
申请公布号 JPH07326867(A) 申请公布日期 1995.12.12
申请号 JP19940119112 申请日期 1994.05.31
申请人 NEC CORP 发明人 SUMIDA SATOSHI
分类号 H05K3/00;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/00
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