INTEGRATED OPTO-ELECTRONIC PACKAGE

摘要

PURPOSE: To provide an integrated photoelectronic package with which a semiconductor chip is provided, the large array of light emitting devices is formed on the upper part of that chip and a complete real image is generated by operating this array together. CONSTITUTION: Light emitting devices 12 are arranged in the form of rows and columns and connected to a pad 20 adjacent to the outside terminal part of a semiconductor chip 10. A window frame board 25 has a central opening 27 having the same spread as the real image to be generated by the chip 10 and a mount pad 30 and is bump-connected with the pad 20 on the chip 10. Plural driving circuits 57 are connected with the light emitting devices 12 through a terminal 33 on the window frame board 25. On the opening part 27 of the board 25, a lens is fitted on the opposite side of the chip 10 and prepares a virtual image easy to see by extending the real image.