SEMICONDUCTOR PACKAGING PART

摘要

PURPOSE:To provide the title semiconductor packaging part having excellent wettability of a bonding agent at four corners of bare chips. CONSTITUTION:Within the title semiconductor packaging part having almost rectangular die pad 2 mounting bare chips of a semiconductor element through the intermediary of a bonding agent as well as conductive patterns 3 electrically connecting to the bare chips to be arranged around the die pad 2, the die pad 2 is provided with the bonding agent running-in parts 5 formed in a trench shape near the four corner parts.