ELECTROCASTING LEAD FRAME OF SEMICONDUCTOR DEVICE AND FABRICATION THEREOF

摘要

PURPOSE:To prevent deformation of lead pin and deviation of pitch during transfer, stocking or connection with semiconductor chip by leaving in direct a photoresist film used for formation of pattern during the electrocasting process between the adjacent lead pins. CONSTITUTION:A dia pad 2 is formed at the center and many lead pins 6 consisting of tab lead 3, inner lead 4 and outer lead 5 are formed surrounding the die pad 2. The photoresist film 14 used for formation of pattern during electrocasting process is left in direct between many lead pins 6 which are provided in parallel with small pitch. That is, such photoresist film is left as it is for use as the lead reinforcing member. Thereby, deformation of lead pins 6 in the horizontal or vertical direction, deviation of pitch and contact between lead pins 6 during transfer and stocking thereof can be surely prevented.