| 摘要 |
PURPOSE:To protect products subjected to a performance check against defects which occur in use or are caused by handling in transit by a method wherein the loop height of a metal wire and the diameter of a ball provided to the metal wire are measured, and the tip of a lead terminal or an island is cut off when the measured values deviate by more than allowable values. CONSTITUTION:A semiconductor device is manufactured through a die bonding process, a wire bonding process, a packaging process where synthetic molding resin is used, and a performance check process. In this case, a measuring process wherein the loop heights H1 and H2 of metal wires 7 and 8 and the diameters d1 and d2 of balls 7a and 7b bonded to the electrode pads 4a and 4a of a semiconductor chip 4 are measured is provided after a wire bonding process. Furthermore, a process wherein the tip of a lead terminal or an island is cut off when either or both of the loop heights H1 and H2 of metal wires 7 and 8 and the diameters d1 and d2 of balls 7a and 7b deviate by more than allowable values is provided. |
