发明名称 MULTILAYER PRINTED WIRING BOARD AND PRODUCTION THEREOF
摘要 PURPOSE:To obtain an inexpensive and highly reliable multilayer printed wiring board by detecting erroneous lamination or missing thereof easily without requiring any expensive facility. CONSTITUTION:When first, second and third inner layer boards 1a, 1b, 1c are laminated normally, a first through hole 2a, a land 3a connected therewith, a conductive rubber 5, a land 3b1, a second through hole 2b, a land 3b2 connected therewith, a conductive rubber 5, a land 3c1, and a third through hole 2c connected therewith establish a single circuit and conducted. Since the circuit is interrupted and rendered nonconductive in case of erroneous lamination of the inner layer boards or missing thereof, erroneous lamination or missing thereof can be prevented by detecting the conduction using a tester 6 during the lamination process.
申请公布号 JPH07321468(A) 申请公布日期 1995.12.08
申请号 JP19940110645 申请日期 1994.05.25
申请人 NEC CORP 发明人 IIZUKA MITSUTAKE
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址