发明名称 ANISOTROPIC CONDUCTIVE BONDED STRUCTURE AND ITS MANUFACTURE
摘要 <p>PURPOSE: To provide an anisotropic conductive adhesive structure which has low connecting resistance, high current capacity, and high high-density connecting reliability, by forming conductive member on a recyclable substrate and coating insulating adhesive on it. CONSTITUTION: In holes of a conductive member forming board 20 which is a glass board 21 which has many separated micro holes 26 and is covered by a mask 23, conductive material such as gold is filled into the holes in electrolytic plating method and is projected from upper surface of the mask 23 like a bump to form a conductive member 2. Next, epoxy based adhesive is coated on the conductive member to form adhesive film layer 1. Finally, by separating the layer from the board 20, an anisotropic conductive adhesive structure in which conductive members 2 with uniform shape and size are distributed homogeneously on its surface. The conductive member forming board 20 can be used many times to form conductive members 2.</p>
申请公布号 JPH07320543(A) 申请公布日期 1995.12.08
申请号 JP19950099788 申请日期 1995.03.31
申请人 WHITAKER CORP:THE 发明人 ISHIBASHI KAZUO;TATEISHI AKIRA
分类号 G02F1/1345;H01B5/16;H01B13/00;H01R11/01;H01R43/00;H05K3/20;H05K3/32;H05K3/36 主分类号 G02F1/1345
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