| 摘要 |
PURPOSE:To provide a method of manufacturing a semiconductor device, wherein a short circuit is restrained from occurring between adjacent bonding wires at wire bonding even if the wires are long. CONSTITUTION:A semiconductor device is equipped with an IC chip 11 connected to an inner lead 16 with a bonding wire 15, wherein a bonding relay pad 19 which is circular and as small as a bonding mark of a second bonding operation is provided between the IC chip 11 and the inner lead 16. |
