摘要 |
<p>An adhesive tape for electronic parts, comprising (a) a heat resistant base film, and (b) an adhesive layer laminated on at least one surface of said base film, said adhesive layer comprising (i) a resol type phenol resin, and (ii) an acrylonitrile/butadiene copolymer, in a proportion of from 100 to 500 parts by weight of said resol type phenol resin per 100 parts by weight of said acrylonitrile/butadiene copolymer, said resol type phenol resin being selected from the group consisting of bisphenol A type resins, alkylphenol type resins, phenol type resins and their co-condensed type phenol resins which contain as the phenol component at least one member selected from the group consisting of bisphenol A, alkylphenols and phenol.</p> |
申请人 |
TOMOEGAWA PAPER CO., LTD., TOKIO/TOKYO, JP |
发明人 |
SAKUMOTO, YUKINORI C/O TOMOEGAWA PAPER CO., LTD., SHIZUOKA-SHI SHIZUOKA-KEN, JP;YOKOYAMA, SHIGEYUKI C/O TOMOEGAWA PAPER CO., LTD., SHIZUOKA-SHI SHIZUOKA-KEN, JP;SHIBUYA, AKIHIRO C/O TOMOEGAWA PAPER CO., LTD., SHIZUOKA-SHI SHIZUOKA-KEN, JP;KOSHIMURA, ATSUSHI C/O TOMOEGAWA PAPER CO., LTD., SHIZUOKA-SHI SHIZUOKA-KEN, JP |