| 发明名称 |
Wave soldering Apparatus and process. |
| 摘要 |
<p>A wave soldering process and apparatus in which a localized low oxygen-containing atmosphere is provided at the point of contact of the solder wave and the substrate to be soldered by bubbling an inert gas through the solder wave. <IMAGE></p> |
| 申请公布号 |
EP0685287(A1) |
申请公布日期 |
1995.12.06 |
| 申请号 |
EP19950303027 |
申请日期 |
1995.05.03 |
| 申请人 |
THE BOC GROUP, INC. |
发明人 |
NAYAR, HARBHAJAN S.;ADAMS, SEAN M.;SAXENA, NEERAJ;WASICZKO, BOHDAN A. |
| 分类号 |
B23K3/06;(IPC1-7):B23K3/06 |
主分类号 |
B23K3/06 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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