| 摘要 |
A method of producing a heat pipe-type semiconductor cooling device wherein one or a plurality of through holes are provided in a long metallic member, which is then cut into a predetermined length to obtain predetermined metallic blocks. The ends of the through holes of the metallic blocks are sealed and the heat-absorbing portion is constituted of the heat-junction and then one end of a heat pipe is fitted thereto. Or the end of the heat pipe is fitted to the through hole, the end of the through hole is sealed, and they are heat-joined to constitute the heat-absorbing portion. Then, a fin is forced into the other end of the heat pipe to constitute the heat-radiating portion. |
