| 摘要 |
A polymer thick film resistor composition is disclosed which comprises: (1) finely divided particles of a conductive metal having a surface area of 0.3 to 3.0 m2/g; (2) finely divided particulate material having a surface area greater than 100 m2/g; (3) a thermoplastic resin; dissolved in (4) an organic solvent having a volatility rating of 10,000 to 50,000; wherein the composition is substantially curable within 2.5 minutes by heating to a temperature of 135 DEG C., and further wherein the volume ratio of particulate material to resin is at least 3.5, and the weight ratio of solvent to resin is 3 to 5.
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