| 摘要 |
PURPOSE:To surely prevent molding resin from flowing out at the time of molding of a resin mold package of a semiconductor device. CONSTITUTION:A dam 7 for molding resin such as a silicone rubber having heat resistance and the low coefficient of elasticity is provided directly by sticking by an adhesive agent material such as silicone resin in a position where a plurality of leads of a lead frame 1 are pinched and held by a top force 3 and bottom force 4, at the time of molding, the gap between the leads of the lead frame 1 is stopped by the dam 7 for the molding resin and the molding resin is prevented from flowing out. |
