Solder ball supply device

摘要

PCT No. PCT/JP94/00337 Sec. 371 Date Oct. 11, 1994 Sec. 102(e) Date Oct. 11, 1994 PCT Filed Mar. 2, 1994 PCT Pub. No. WO94/28580 PCT Pub. Date Dec. 8, 1994.A solder ball supply device comprising flux supply means 200 which supplies flux at the same time to input and output terminals on substrate 1 prior to supply of solder balls, and solder ball supply means 300 which takes out a number of solder balls from discharger 350 in which solder balls are held matrixwise at the same time in the same pattern as the pattern of said input and output terminals and supplies solder balls to said input and output terminals to which flux has been supplied.