| 摘要 |
PURPOSE:To provide an IC package having a higher heat radiation effect. CONSTITUTION:A heat radiation member 17 is mounted on the surface 11b on the opposite side to the chip mounting surface 11a of a package main body 11 and an electrode part 15 for outside connection is guided out to the side of a lid body 13 of the package main body 11 so as to constitute so that a heat-transmitting path from an IC chip 12 to the heat radiation member 17 may be shortened. |
