发明名称 |
SYSTEM AND METHOD FOR INCREMENT MANUFACTURE OF CIRCUIT BOARD |
摘要 |
PURPOSE: To realize a mechanism which cost-efficiently meets high-density ultra-fine shape requirements for future PC boards by converting design data into a three-dimensional increment matrix to incrementally deposit manufacturing materials in shown increment modes. CONSTITUTION: A circuit board designer prepares design information and component characteristics on a CAD computer 120 and transfers them to a conversion computer 122. After transferring the converted data to a manufacturing station 124 which then produces circuit boards according to the three-dimensional matrix data. Manufacturing cabinets 132 produce the circuit boards, based on the three- dimensional matrix under the control of a manufacturing controller 134 while a raw material feed system 136 feeds manufacturing materials 126 to the cabinets 132. The completed circuit boards are ejected from the station 124 as shown by block 130, to realize a mechanism meeting high-density ultra-fine shape requirements for printed circuit boards. |
申请公布号 |
JPH07307547(A) |
申请公布日期 |
1995.11.21 |
申请号 |
JP19950105269 |
申请日期 |
1995.04.28 |
申请人 |
HEWLETT PACKARD CO <HP> |
发明人 |
ROBAATO EFU BOTSUJIO JIYUNIA |
分类号 |
G06F17/50;H05K3/00;H05K3/12;H05K3/46;(IPC1-7):H05K3/00 |
主分类号 |
G06F17/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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