| 摘要 |
The semiconductor assembling device having a semiconductor chip, a lead frame having a paddle and a plurality of inner and outer leads, a plurality of metal wires for electrically connecting a bond pad of the semiconductor chip to the inner lead of the lead frame and a mold resin for forming a package body by sealing a predetermined portion containing the wire-bonded semiconductor chip and inner lead, is characterized in that a noise filtering unit for stabilizing frequency by removing noise is formed between power pads of the semiconductor chip.
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