| 摘要 |
PURPOSE:To automate a wafer transport means and construct it in a consolidated structure, compared with a conventional arrangement in which wafer polishing and transportation are made in separated processes to result in poor working effectiveness and risk of attachment of impurities exists because the wafer is in touch with the carrier surface. CONSTITUTION:Air is jetted from a jet provided in the center of a wafer holder 5, and thereby a wafer is held by the holding surface of the holder contactlessly, and upon polishing on a surface plate 1 rotating, air jetting is switched over to the spout of a pure wafer, and the oversurface and undersurface of the wafer are washed at the same time on a pure water shower 8. |
