| 摘要 |
PURPOSE: To obtain an integrated circuit testing equipment which permits the test of a few integrated circuit dies, by a method wherein a plurality of alignment pins align a first and a second flexible contact structures mutually on a pad on the integrated circuit die. CONSTITUTION: A base printed wiring board interface 11 is constituted to interface with a testing equipment 15, and an equipment 10 is used. A base printed wiring board 21 has a plurality of electric contact pads 22 connected with the testing equipment 15. A selected electric contact pad 22 is bonded to a first contact structure 30. Two flexible members 31, 32 of the first contact structure 30 are mutually isolated by a previously decided distance, and fixed and aligned on the printed wiring board 21 by a plurality of first alignment pins 36. A plurality of second alignment pins 37 are arranged on the printed wiring board 21 which is used for fixing and aligning an integrated circuit die holding equipment 12 and a second contact structure 40. |
