| 摘要 |
PURPOSE:To prevent the peeling-off of an electrode due to wire bonding by obtaining sufficient electric contact by lowering contact resistance by making easier the alloying by heat treatment between a compound semiconductor and an electrode. CONSTITUTION:While the top of a compound semiconductor 1 is covered with a patterned photosensitive organic film 3, the compound semiconductor 1 is immersed in a hydrofluolic aqueous solution, and electrical contact between the compound semiconductor 1 and an electrode 2 obtained by the vapor deposition of a metal thereafter is improved by removing the oxide formed on the surface of the compound semiconductor 1 and also the peeling-off of the electrode by the wire bonding is prevented. |
