发明名称 MOUNTING MECHANISM OF ELECTRONIC APPARATUS
摘要 PURPOSE:To obtain the mounting mechanism, of an electronic apparatus, whose structure is simple by installing a spring mechanism wherein, when a slide plate is pressed down, an upward force acting so as to return the slide plate to its original position is applied to the slide plate. CONSTITUTION:A groove 3 for coupling is coupled to an overhang part 22a at a special rail 20, and a case body is turned to the Z-direction. Then, a overhang part 22b presses down a slide plate 10 against the springy force of a spring part 14a, it strides over the upper-part edge of the slide plate 10, and it comes into contact with the bottom face of a groove 2 for the special rail. At this time, since spring parts 14a, 14b which have been opened are going to return to their original positions, the slide plate 10 is pressed upward, the overhang part 22b falls into a V-shaped groove which is formed by an edge 12b at the slide plate 10 and by the bottom face of the groove 2 for the special rail, and the case body 1 is held firmly by the special rail 20. Thereby, it is possible to obtain a mounting mechanism whose structure is simple and in which an electronic apparatus can be mounted on the special rail quickly and surely.
申请公布号 JPH07302988(A) 申请公布日期 1995.11.14
申请号 JP19940093267 申请日期 1994.05.02
申请人 NEC CORP 发明人 ISHIDA NAOKI
分类号 H05K7/12 主分类号 H05K7/12
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