发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To realize good electrical connection by a bonding wire even a control circuit block is highly integrated and to eliminate insulation failure by providing a bonding wire for connecting first and second electrode pad regions and an outside terminal region electrically. CONSTITUTION:A second conductive layer wiring 6 with a second electrode pad region 10 is formed isolated from a first conductive layer wiring 5 formed on an element region 8 with a first electrode pad region 9 adjoining in a layer insulation film 4 by the layer insulation film 4. The layer insulation film 4 is not formed on a surface of each conductive layer wiring and an exposed part becomes an electrode pad region and a bonding wire 11 is connected thereto. That is, the second electrode pad region 10 is electrically insulated from regions excepting the first electrode pad region 9 and an element region 8. The layer insulation film 4 can be a multilayer structure and the second electrode pad region 10 can be formed in any part of the layer.
申请公布号 JPH07297218(A) 申请公布日期 1995.11.10
申请号 JP19940090425 申请日期 1994.04.28
申请人 TOSHIBA CORP 发明人 ONO MASAYA;ARAI HARUKI
分类号 H01L21/60 主分类号 H01L21/60
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