| 摘要 |
PURPOSE:To provide a wire bonding device in which a space especially designed for preparing detection elements is unnecessary, when detecting a pressing force due to a bonding arm and a frictional force due to ultrasonic vibration. CONSTITUTION:In a wire bonding device where wire bonding is performed by a bonding arm 9 with which an ultrasonic signal is added against a lead frame 30 placed on a work stage 25, a piezoelectric element 28 to detect a pressing force due to the bonding arm and a frictional force due to the ultrasonic vibration generating during wire bonding process is formed in a reccessed part 26 prepared on a work stage in a manner that the upper face and the upper surface of the work stage may form the same surface. |
