| 摘要 |
PURPOSE:To make improvements in working efficiency as well as to manufacture a wafer being high in taper removing accuracy by automating the whole process ranging from measuring a thickness distribution to polishing work. CONSTITUTION:A thickness distribution in both X and Y directions of a wafer is found by a thickness measuring machine 3, and a taper T and a machining allowance So are found out of the thickness distribution through a least square method by a central processing unit 1, and an amount of eccentricity delta between the center of the wafer and the pressing load center is calculated by an expression of delta=T.R/8.So (R is wafer diameter). This wafer is transferred to a polishing fixed part on a X-Y stage 5 by a robot 4. The wafer is polished in a position of the eccentricity delta on the basis of eccentricity data out of the central processing unit 1 by the X-Y stage, and then a wafer suction plate 21 is clamped. The fixed wafer is pressed to abrasive cloth 29, an abrasive cloth turning device 7 is rockably revolved as rotating the wafer, whereby polishing is carried out as supplying an abrasive. In addition, the eccentricity deltais compensated by remeasurement of the thickness distribution after polishing, and thus polishing conditions are regulated. |
