| 摘要 |
PURPOSE:To secure such a method as capable of polishing the whole body of a projecting side surface of a semiconductor wafer with a warp uniformly in an automatic manner. CONSTITUTION:This is a polishing method of a semiconductor wafer with a warp, which is featured that a wafer holder 1 designed so as to hold a weight 14 shiftably and to vary the centroid is made into a state that the semiconductor wafer 3 with the warp is mounted and clamped on a recess side on the basis of the warp, and then the wafer 3 is slidden on an abrasive surface 51 via a projection side 31 on the basis of the warp. With this method, a semiconductor wafer portion uncontacted with the abrasive surface due to the warp is made in contact with this abrasive surface by such a pressing means as via an inclination due to centroidal variations in the wafer holder, so that it is automatically polished, and thus even in the case of the semiconductor wafer with a large warp, the whole body of its projecting side surface is uniformly polishable on the average. |
