| 摘要 |
PURPOSE:To acquire an economical multilayer wiring board of good wiring density by providing one or more insulating layers made of glass cloth reinforced resin whose linear expansion coefficient in X and Y directions is specified. CONSTITUTION:A surface copper foil of glass cloth/epoxy resin double-sided copper clad lamination boards 2a whose linear expansion coefficient in X and Y directions is 13ppm/ deg.C or less is processed by an existing etching method and an inner layer conductor circuit layer 1 is formed. Then, an epoxy resin film which does not include glass cloth and a copper foil are laminated in a surface thereof as an insulation layer 2b which becomes an outermost layer and made multilayer by press lamination at specified temperature and pressure. After a through hole is shaped by a drill and a through-hole 3 is formed by applying copper plating 4 to an inside of the hole, an outerlayer conductor circuit layer 1 is formed by an existing etching method and a multilayer wiring board is acquired. Since an insulation layer 2a whose linear expansion coefficient is 13ppm/ deg.C or less is used in the wiring board, linear expansion coefficient of an entire of the wiring board can be controlled at a specified amount or less. |
