| 摘要 |
PURPOSE:To provide a method for forming solder bumps which are more excellent in the quality and reliability than the conventional ones. CONSTITUTION:This is a method for forming a solder bump 8 on a pad electrode 3 of a circuit board 1 which constitutes a plastic molded semiconductor device using a solder ball 8a. First, solder paste 11 is applied am the pad electrode 3. Then, a solder ball 8a is expediently placed on the pad electrode 3 through the solder paste 11. Nextly, the solder ball 8a is welded to the pad electrode 3. |
