发明名称 ELECTRONIC COMPONENT MOUNTING MACHINE
摘要 PURPOSE:To perform a subordinate operation at a good timing to match a small movement of a nozzle by employing an amplifying valve for achieving a subordinate process of sucking an electronic component with the nozzle upon receiving of a high pressure from a first valve by a differential valve as a pilot valve for catching an operation of the nozzle by the first valve. CONSTITUTION:A suction nozzle 1 is moved down and a valve seat 11 is opened. Since high pressure air of a valve chamber 13 is vented, the high pressure air is not supplied to a valve chamber 16a through a communicating unit 17, and a differential valve 15 remains deviated upward by a compression spring 22 and does not move. After an electronic component 4 is mounted on a board, the nozzle 1 is raised, its disc is raised by an operation controller, and the high pressure air is again supplied to the chambers 13 and 16b via the unit 17 and a switching valve. In this case, since the high pressure is operated at a small bore disc 20 at the valve 15, the valve 15 is still maintained in a state deviated upward for next component sucking operation.
申请公布号 JPH07283595(A) 申请公布日期 1995.10.27
申请号 JP19940068601 申请日期 1994.04.06
申请人 HITACHI TECHNO ENG CO LTD 发明人 YABUNO KOHEI;SAITO TADAYUKI;TAKAHASHI KENICHI
分类号 B23P21/00;H05K13/04 主分类号 B23P21/00
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