发明名称 FORMATION OF COVERING CONTAINING SI-O
摘要 PURPOSE: To provide a coating which has improved electrical property by annealing an Si-O containing film, obtained by transforming H-resin in damp/dry ammonium, in oxygen containing atmosphere. CONSTITUTION: H-resin is heated at a temperature in the range of 75-400 deg.C, under an atmosphere containing both ammonium and steam. Next, the H-resin is heated at a temperature in the range of 74-400 deg.C, under the atmosphere containing substantially moisture-free ammonium, so as to get an Si-O containing ceramic film. The obtained Si-O containing ceramic film is heated at a temperature of at least 150 deg.C for enough time to anneal this film, under oxygen containing atmosphere. As a result of this, the dielectric loss can be improved.
申请公布号 JPH07283212(A) 申请公布日期 1995.10.27
申请号 JP19950078745 申请日期 1995.04.04
申请人 DOW CORNING CORP 发明人 ROBAATO CHIYAARUZU KAMIRETSUTEI;FUREDORITSUKU CHIYAARUZU DAARU;DAIANA KAI DAN
分类号 H01L23/29;H01L21/316;H01L21/56;H01L23/31;H01L23/532;(IPC1-7):H01L21/316 主分类号 H01L23/29
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