| 摘要 |
<p>PURPOSE:To very accurately position a wafer on a dicing table without using a picture image recognition device or the like by a method wherein the wafer attaching underside of a sheet is supported by projections provided to the surface of the dicing table, and the other part of the sheet is supported by a sheet holder. CONSTITUTION:A sheet 30 is placed on an adhesive layer 23 of a sheet holder 20 so as to be held by the adhesive layer 23 by adhesion, and then wafers W are pasted on the upside of the sheet 30 correspondent to through-holes 22. Then, the sheet holder 20 is transferred to a dicing table 10, and the through- holes 22 are fitted to the projections 12 of the dicing table 10. Then, the sheet holder 20 is pressed against positioning pins 16 and 17 with a cylinder device 18 to position the wafers W. Then, a vacuum suction device 14 is actuated to attract the sheet 30 to the upsides of the projections 12. As the sheet 30 is attracted, the wafer W is diced with a dicer blade.</p> |
