| 摘要 |
<p>PURPOSE:To promote rationalization of a manufacturing process and marked thinning of a semiconductor substrate. CONSTITUTION:A first liquid is applied on the surface of a semiconductor wafer 22 and this first liquid is made to congeal so as to form a protective film 26 on the surface of the semiconductor wafer 22. Next, a second liquid 28a having a lower freezing point than the first liquid is applied on a work plate 27 and the semiconductor wafer 22 is loaded on the work plate 27 so that the second liquid 28a may come in contact with the protective film 26. Next, the second liquid 28a is made to congeal so as to fix the semiconductor wafer 22 on the work plate 27 by a fixing film 28. Next, after grinding the rear of the semiconductor wafer 22 by a grindstone 29 followed by thawing the fixing film 28, the semiconductor wafer 22 is taken down from the work plate 27. Accordingly, rationalization of a manufacturing process and marked thinning of the semiconductor can be promoted.</p> |
