发明名称 MANUFACTURE PROCESS OF INTEGRATED CIRCUIT
摘要 <p>PURPOSE: To prevent a fragment at square cutting from being heaped up on a device by cutting a board square after forming an organic film which has specified structure of a semitransparent film being insoluble to water and soluble to alcohol, on the board, and then removing the organic film with an organic solvent. CONSTITUTION: A semitransparent protective film 65 is made on a board 10. The covered board 10 having a device 20 is put on a fixing and cutting tape 55. The protective film is relatively insoluble to water, and dissolves in lower alcohol. The protective film is made of a material having organic components and polar groups. An appropriate organic section contains an aliphatic group section and an aromatic section. An appropriate polar functional group contains a hydroxyl group, a carbonyl group, and a carboxyl group. Rosin-containing material is an example of appropriate protective film material. After cutting of the board 10 into squares, it is immersed in alcohol, and agitated, and after takeout from the vessel, the board 10 is cleaned in deionizing water.</p>
申请公布号 JPH07283175(A) 申请公布日期 1995.10.27
申请号 JP19950074295 申请日期 1995.03.31
申请人 AMERICAN TELEPH & TELEGR CO <ATT> 发明人 IINON DEGANI;DEEN POORU KOTSUSHIBUZU
分类号 H01L21/301;H01L21/304;H01L21/68;H01L21/78;(IPC1-7):H01L21/304 主分类号 H01L21/301
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