| 发明名称 |
Low temperature co-fired ceramic (LTCC) high density interconnect package with circuitry within the cavity walls |
| 摘要 |
A unitized integrally fused multilayer circuit package having a substrate, walls disposed on the substrate to form a central circuit package cavity, and circuit traces contained in the walls.
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| 申请公布号 |
US5461196(A) |
申请公布日期 |
1995.10.24 |
| 申请号 |
US19920984401 |
申请日期 |
1992.12.02 |
| 申请人 |
HUGHES AIRCRAFT COMPANY |
发明人 |
VIRGA, KATHLEEN;CISCO, TERRY;OWENS, JOSEPH N.;SHODA, CRAIG |
| 分类号 |
H01L23/12;H01L23/08;H01L23/13;H01L23/498;H01L23/538;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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