| 摘要 |
A device and method of manufacture for producing electrically conductive regions in hermetically sealed insulative plates or hermetically sealed electronic component enclosures. The electrically conductive regions consist of a monolithic composite material comprising particles of an insulative material and a conductive metal. The material of the insulative particles, their size, and the type of conductive metal used are selected so that the coefficient of thermal expansion (CTE) of the resulting electrically conductive region approximates the CTE of the surrounding material.
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