| 摘要 |
PURPOSE:To obtain a compound semiconductor device which is excellent in adhesive properties, heat resistance, and moisture resistance, can be cured at a low temp. or at a high rate, and is highly reliable by bonding a compound semiconductor chip to a lead frame with a specific conductive paste. CONSTITUTION:A compound semiconductor device is obtd. by bonding a compound semiconductor chip to a lead frame by using a conductive paste comprising a modified resin obtd. from an epoxy resin, a phenol-resin-base curative, and a sulfonium salt of formula I (X is CH3, H, halogen, or NO2; and M is Sb, As, or P) or formula II (R<1> and R<2> are each alkyl, halogen, or H; R<3> is an ether or ester group; and A<-> is SbF6<->, AsF6<->, PF6<->, or CH3SO4<->), a conductive powder, and a solvent and/or a monomer. The device is excellent in adhesive strength and moisture resistance, hardly warps, and is free from disconnection due to corrosion of an aluminum electrode. The conductive paste can be cured at a low temp. or at a high rate, contributing to shortening the assembly step. |
