发明名称 METHOD AND DEVICE FOR PROCESSING SEMICONDUCTOR WAFER
摘要 <p>A light source used for heating a semiconductor wafer is installed at a place where the atmosphere is different from that in the clean room where the processing apparatus are provided, outside the clean room. The light energy from the light source is sent through an optical fiber so as to heat the wafer uniformly. The main component of the light emitted from the light source has wavelengths that are efficiently absorbed by the wafer. Since the temperature distribution of the wafer is uniform, high-quality processings can be performed. Moreover, since the optical fiber is used, excessive heat is not generated in the clean room. The cost of the facility of the clean room, its operating cost and the sizes of the processing apparatus and the clean room can be reduced, and therefore, the manufacturing cost of the wafer can be reduced.</p>
申请公布号 WO1995028002(P1) 申请公布日期 1995.10.19
申请号 JP1995000701 申请日期 1995.04.10
申请人 发明人
分类号 主分类号
代理机构 代理人
主权项
地址
您可能感兴趣的专利