发明名称 Semiconductor memory device having a double-stacked capacitor structure
摘要 A semiconductor memory device having a double-stacked capacitor, and methods for manufacturing the same, are disclosed. Such memory device has a first stacked capacitor and a second stacked capacitor, which are formed respectively over and below a bit line and run in parallel and are connected in order to increase the capacity of the capacitors and to prevent contact faults caused by a step occurring.
申请公布号 US5315141(A) 申请公布日期 1994.05.24
申请号 US19930122100 申请日期 1993.09.16
申请人 HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. 发明人 KIM, JAE K.
分类号 H01L27/04;H01L21/02;H01L21/822;H01L21/8242;H01L27/10;H01L27/108;(IPC1-7):H01L29/94 主分类号 H01L27/04
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