| 摘要 |
PURPOSE:To reduce the generation of a wire bonding mistake when wire bonding is applied to an electrode part by forming a pair of first dummy patterns on the upper surface of each LED array semiconductor chip simultaneously with the formation of respective light emitting parts and further forming second dummy patterns thereon simultaneously with the formation of respective electrode parts. CONSTITUTION:A plurality of LED array semiconductor chips 2 each constituted so that a plurality of light emitting parts 2a are formed on the upper surface of an insulating substrate 1 at a constant pitch interval in one row and electrode parts 2b are formed thereon corresponding to the light emitting parts 2a are arranged in one row to be subjected to die bonding to constitute an LED array printing head. A pair of first dummy patterns 2R, 2L are formed on the upper surface of each LED array semiconductor chip 2 simultaneously with the formation of respective light emitting parts 2a and second dummy patterns 2R', 2L' are further formed thereon simultaneously with the formation of respective electrode parts 2b. As a result, at the time of the wire bonding to the respective chips 2, the generation of a wire bonding mistake can be reduced. |
