MEMORY MODULE

摘要

A memory module with several semiconductor packages has wiring patterns on a substrate with contacts to mount capacitative connections and auxiliary contacts to connect functioning data lines. The substrate has input and output pins at the ends of the wiring pattern. The capacitative connections to the contacts prevent electrical damage during the activation and deactivation of the semiconductor blocks having external connections to the contacts on the substrate. The auxiliary contacts lie to one side of the block mounts and a coupling selectively connects the normal data lines to the auxiliary contacts excepting those of a defective line. With at least one defective line, the sum of the normal capacity exceeds the total memory of the whole module.