| 摘要 |
<p>PURPOSE:To improve the electromigration resistance of a wiring connected with a pad. CONSTITUTION:In the title semiconductor device, a wiring 11b composed of metal containing aluminum is connected with a pad 13a which is composed of the metal containing aluminum and turned into an outward leading-out terminal, via a wiring 11a which is formed on a layer different from the wiring or the pad and composed of refractory material.</p> |
