| 摘要 |
<p>PURPOSE:To provide an adhesive film for dicing a semiconductor wafer, which holds a semiconductor wafer firmly at the time of dicing and can easily be peel when picking up a semiconductor chip after dicing, and its dicing method. CONSTITUTION:The sticking and dicing are performed at the fusing point (the heat absorption peak temperature measured with DSC - graduation scanning calorimeter-) or over of the pressure sensitive adhesive of an adhesive for dicing of a semiconductor wafer, and the semiconductor chip after dicing is peeled at a fusing point or under. The adhesive strength varies three times or more, depending upon whether it is over or under the fusing point, and 50wt.% or more of the material monomers constituting the adhesive are constituted of acrylic acid ester, methacrylic acid ester, or the like, which has ester of 12 or over in the number of carbons.</p> |
