| 摘要 |
<p>PURPOSE: To provide a heating device which can joint a chip or a structure to be connected with solder on a connection supporter and conforms to a maximum temperature which the connection supporter, such as a structure comprised of a flat display screen, can resist. CONSTITUTION: A heating device connects at least one structural element 118 mounted on a connection supporter 112 to at lest one connection region 114 on the periphery of the support 112 with a meltable material 120. The heating device is provided with a device for locally heat the supporter 112 and/or the structural element 118. The local hating device is provided with a heating plate 102, having at least one region 106 for transferring heat to the supporter 112 in the connection region 114. The heat transferring region 106 is provided on a protrusion 104 of the heating plate 102 which protrudes from a flat part 122 orientated to the supporter 112 for holding a heat protective air film between the flat part 122 and the part of the supporter 112 other than the connection region 114.</p> |
