发明名称 |
POWER SEMICONDUCTOR MODULE |
摘要 |
PURPOSE:To provide a power semiconductor module with cover bodies, which can be made to correspond to a change in the positions of lead-out conductors and an increase and a decrease in the conductors. CONSTITUTION:A power semiconductor module is constituted of a main body 1 having a plurality of lead-out conductors 2 connected with a power semiconductor chip and a plurality of independent cover bodies 3, which respectively have an insertion hole enable each lead-out conductor 2 to penetrate and are placed on the main body 1. |
申请公布号 |
JPH07263623(A) |
申请公布日期 |
1995.10.13 |
申请号 |
JP19940079461 |
申请日期 |
1994.03.24 |
申请人 |
SANSHA ELECTRIC MFG CO LTD |
发明人 |
SAITO KOICHI;NAKAMURA YUKIYOSHI |
分类号 |
H01L25/07;H01L25/18;(IPC1-7):H01L25/07 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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