发明名称 POWER SEMICONDUCTOR MODULE
摘要 PURPOSE:To provide a power semiconductor module with cover bodies, which can be made to correspond to a change in the positions of lead-out conductors and an increase and a decrease in the conductors. CONSTITUTION:A power semiconductor module is constituted of a main body 1 having a plurality of lead-out conductors 2 connected with a power semiconductor chip and a plurality of independent cover bodies 3, which respectively have an insertion hole enable each lead-out conductor 2 to penetrate and are placed on the main body 1.
申请公布号 JPH07263623(A) 申请公布日期 1995.10.13
申请号 JP19940079461 申请日期 1994.03.24
申请人 SANSHA ELECTRIC MFG CO LTD 发明人 SAITO KOICHI;NAKAMURA YUKIYOSHI
分类号 H01L25/07;H01L25/18;(IPC1-7):H01L25/07 主分类号 H01L25/07
代理机构 代理人
主权项
地址