摘要 |
The invention concerns a palladium colloid solution which, in addition to a palladium compound, a protective colloid for stabilising the colloid and a reducing agent, additionally contains precious metals from the group including rhodium, iridium and platinum. The solution can be used to treat electrically non-conductive substrate surfaces, in particular to metallize the substrate surfaces directly by electrolysis. By means of this process the non-conductive areas of the holes in printed circuit boards can be metallized directly by electrolysis.
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申请人 |
ATOTECH DEUTSCHLAND GMBH, 10553 BERLIN, DE |
发明人 |
MEYER, HEINRICH, DR.DR., 14109 BERLIN, DE;STAMP, LUTZ, DR., 13509 BERLIN, DE |