Low profile mechanical interconnect system having metalized loop and hoop area

摘要

A substrate (100) includes a surface (102) having a hook and loop fastener area (106). The area (106) is selectively metallized to produce interconnect points (108). The area (106) is used to attach a connector, another substrate, or a flex circuit to the substrate (100) without the use of solder or other conductive adhesives. The area (106) provides for the mechanical coupling. The selectively metallized areas (108) provide for the electrical coupling of the two substrates.