Einrichtung zum Kühlen von zu Flachbaugruppen zusammengefaßten gehäuselosen filmmontierten integrierten Bausteinen
摘要
The heat sink comprises a common coupling plate (1) with cooling channels (8) for a heat transfer medium in contact with each of the micro-packages. The contact pressure is provided by a spring element between the package and the surface of the circuit board. The spider (4) providing the package outer leads attached to the circuit board solder pads are Z shaped to compensate path differences in the perpendicular direction. The cooling plate has a heat conductive membrane (2) sealed to its underside with the cooling channels being open on the membrane side. The membrane pref. has a thickness greater than 0.1 mm. ADVANTAGE - Simple mfr. of micro-packages and mounting on surface of circuit board with efficient removal of waste heat.
申请公布号
DE4210834(C2)
申请公布日期
1995.10.05
申请号
DE19924210834
申请日期
1992.04.01
申请人
SIEMENS NIXDORF INFORMATIONSSYSTEME AG, 33106 PADERBORN, DE