发明名称 Silicon microstructure and manufacture thereof.
摘要 <p>A flexible and efficient bulk micromachining method provides a microstructure bounded by substantially planar surfaces meeting only at substantially right angle corner features. The microstructure is useful as a spacer in assembly processes where high accuracy is required, such as precise positioning of optical fibers or conductors. The microstructure includes a shelf feature (26) disposed along a height of the microstructure, which is required for some applications. The bulk micromachining includes providing a first substrate (1) having a top planar surface and an opposing planar surface. The opposing surface of the substrate is anisotropically etched to provide a first thinned region (20). The top surface of the first substrate is anisotropically etched so that a first recessed feature (24) having a vertical side is made integral with the first thinned region. A second substrate (2) having a top planar surface and an opposing planar surface is provided. The opposing surface of the second substrate is anisotropically etched to provide a second thinned region (22). The top surface of the second substrate is anisotropically etched so that a second recessed feature (26) having a vertical side wall is made integral with the second thinned region. The top surface of the first substrate is aligned and coupled with the top surface of the second substrate to produce the desired microstructure. The substrates are cut or sawn to free the microstructure. <IMAGE></p>
申请公布号 EP0674194(A2) 申请公布日期 1995.09.27
申请号 EP19950300828 申请日期 1995.02.09
申请人 HEWLETT-PACKARD COMPANY 发明人 FIELD, LESLIE A.;BARTH, PHILLIP W.
分类号 G02B6/24;G02B6/36;G02B6/38;G02B6/42;H01L21/306;(IPC1-7):G02B6/36 主分类号 G02B6/24
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