发明名称 IC package connector.
摘要 <p>An IC connector (10) receives an IC package (12) which includes a plurality of J-bend type leads (16) arranged in parallel rows along opposite sides of an IC package body (14). The connector includes a housing (27) having package-receiving recess (28) and a pair of rows of terminal-receiving passages (36). A plurality of stamped and formed terminals (38) are received in the passages. Each terminal includes a contact section (44) for contacting a respective one of the leads of the IC package, a retention section (46) for fixing the terminal in a respective one of the passages and a tail section (48a, 48b) exposed exteriorly of the housing. The contact section of each terminal is generally channel-shaped to define a pair of rigidifying side walls (58) extending in planes generally transverse to the side walls of the housing and a central base portion (60) joining the rigidifying the side walls. A pair of resilient cantilevered beam portions (62, 64) are formed from the central base portion of the contact section and define a pair of spring contacts (62a, 64a) projecting into the recess for engaging a respective one of the leads of the IC package. <IMAGE></p>
申请公布号 EP0674474(A1) 申请公布日期 1995.09.27
申请号 EP19950103904 申请日期 1995.03.17
申请人 MOLEX INCORPORATED 发明人 IKESUGI, HIROSHI;SIMMEL, GEORGE M.
分类号 G06F3/00;G01R1/04;H01L23/50;H01R12/70;H01R13/26;H01R33/76;H01R43/16;H05K7/10;(IPC1-7):H05K7/10;H01R23/68 主分类号 G06F3/00
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